Microchip Technology - M2S060-FGG676

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M2S060-FGG676 by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number M2S060-FGG676
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA676,26X26,40;
Datasheet M2S060-FGG676 Datasheet
In Stock379
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 40 s
Maximum Seated Height: 2.44 mm
No. of Inputs: 387
Surface Mount: Yes
No. of Outputs: 387
Position Of Terminal: Bottom
No. of Terminals: 676
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
No. of Logic Cells: 56520
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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Pricing (USD)

Qty. Unit Price Ext. Price
379 $130.120 $49,315.480

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