Image shown is a representation only.
| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | M2S090-FCS325 |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Position Of Terminal: BOTTOM; |
| Datasheet | M2S090-FCS325 Datasheet |
| In Stock | 907 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | Plastic/Epoxy |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| Maximum Seated Height: | 1.16 mm |
| No. of Inputs: | 180 |
| Surface Mount: | Yes |
| No. of Outputs: | 180 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 325 |
| Package Style (Meter): | Grid Array, Thin Profile, Fine Pitch |
| JESD-30 Code: | R-PBGA-B325 |
| Package Shape: | Rectangular |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | TFBGA |
| Width: | 11 mm |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.26 V |
| Nominal Supply Voltage (V): | 1.2 |
| No. of Logic Cells: | 86184 |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| Package Equivalence Code: | BGA325,21X21,20 |
| Finishing Of Terminal Used: | Tin Lead |
| Length: | 13.5 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | .5 mm |
| Peak Reflow Temperature (C): | 240 °C (464 °F) |









