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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | MGC3030-I/SS |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR; |
| Datasheet | MGC3030-I/SS Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 2 mm |
| Surface Mount: | YES |
| Terminal Finish: | MATTE TIN |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 28 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, SHRINK PITCH |
| Length: | 10.2 mm |
| JESD-30 Code: | R-PDSO-G28 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | SSOP |
| Width: | 5.3 mm |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 2 |
