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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | MSCSM170AM11CT3AG |
Description | N-CHANNEL; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; JESD-30 Code: R-XUFM-X25; Maximum Feedback Capacitance (Crss): 40 pF; Minimum DS Breakdown Voltage: 1700 V; |
Datasheet | MSCSM170AM11CT3AG Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Configuration: | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR |
Transistor Element Material: | SILICON CARBIDE |
Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
Transistor Application: | SWITCHING |
Maximum Feedback Capacitance (Crss): | 40 pF |
Maximum Drain Current (ID): | 240 A |
Maximum Pulsed Drain Current (IDM): | 480 A |
Polarity or Channel Type: | N-CHANNEL |
Surface Mount: | NO |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 25 |
Minimum DS Breakdown Voltage: | 1700 V |
Terminal Position: | UPPER |
Package Style (Meter): | FLANGE MOUNT |
JESD-30 Code: | R-XUFM-X25 |
No. of Elements: | 2 |
Package Shape: | RECTANGULAR |
Terminal Form: | UNSPECIFIED |
Operating Mode: | ENHANCEMENT MODE |
Maximum Operating Temperature: | 175 Cel |
Case Connection: | ISOLATED |
Maximum Drain-Source On Resistance: | .0113 ohm |