Microchip Technology - MSCSM170AM11CT3AG

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MSCSM170AM11CT3AG by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number MSCSM170AM11CT3AG
Description N-CHANNEL; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; JESD-30 Code: R-XUFM-X25; Maximum Feedback Capacitance (Crss): 40 pF; Minimum DS Breakdown Voltage: 1700 V;
Datasheet MSCSM170AM11CT3AG Datasheet
NAME DESCRIPTION
Other Names: 150-MSCSM170AM11CT3AG
Package Body Material: UNSPECIFIED
Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
Transistor Element Material: SILICON CARBIDE
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Feedback Capacitance (Crss): 40 pF
Maximum Drain Current (ID): 240 A
Maximum Pulsed Drain Current (IDM): 480 A
Polarity or Channel Type: N-CHANNEL
Surface Mount: NO
Minimum Operating Temperature: -40 Cel
No. of Terminals: 25
Minimum DS Breakdown Voltage: 1700 V
Terminal Position: UPPER
Package Style (Meter): FLANGE MOUNT
JESD-30 Code: R-XUFM-X25
No. of Elements: 2
Package Shape: RECTANGULAR
Terminal Form: UNSPECIFIED
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 175 Cel
Case Connection: ISOLATED
Maximum Drain-Source On Resistance: .0113 ohm
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