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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | PAC1934T-I/J6CX |
| Description | POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: VFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
| Datasheet | PAC1934T-I/J6CX Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Width (mm): | 2.17 mm |
| Maximum Seated Height: | .679 mm |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Maximum Supply Current (Isup): | .675 mA |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 16 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| JESD-30 Code: | R-PBGA-B16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| No. of Channels: | 4 |
| Package Code: | VFBGA |
| Nominal Supply Voltage (Vsup): | 3.3 V |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA16,4X4,20 |
| Other IC type: | POWER SUPPLY SUPPORT CIRCUIT |
| Length: | 2.225 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 5.5 V |
