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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | PM8055B-FEI |
| Description | INTERFACE CIRCUIT; Terminal Form: BALL; No. of Terminals: 1408; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM; |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| No. of Functions: | 1 |
| No. of Terminals: | 1408 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| JESD-30 Code: | S-PBGA-B1408 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | BGA |
| Surface Mount: | YES |
| Interface IC Type: | INTERFACE CIRCUIT |









