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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | SAM9X60-V/DWB |
| Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 228; Package Code: TFBGA; Package Shape: SQUARE; |
| Datasheet | SAM9X60-V/DWB Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.12 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.15 V |
| Integrated Cache: | YES |
| Maximum Seated Height: | 1.2 mm |
| Surface Mount: | YES |
| On Chip Data RAM Width: | 8 |
| No. of Terminals: | 228 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| No. of DMA Channels: | 16 |
| Address Bus Width: | 26 |
| Technology: | CMOS |
| RAM Words: | 69632 |
| JESD-30 Code: | S-PBGA-B228 |
| Maximum Clock Frequency: | 48 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | TFBGA |
| Width: | 11 mm |
| Other Names: | 150-SAM9X60-V/DWB |
| Speed: | 600 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.21 V |
| No. of External Interrupts: | 1 |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| Minimum Operating Temperature: | -40 Cel |
| Package Equivalence Code: | BGA228,16X16,26 |
| Length: | 11 mm |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | INDUSTRIAL |









