Microchip Technology - SAM9X60-V/DWB

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SAM9X60-V/DWB by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number SAM9X60-V/DWB
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 228; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet SAM9X60-V/DWB Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.12 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.15 V
Integrated Cache: YES
Maximum Seated Height: 1.2 mm
Surface Mount: YES
On Chip Data RAM Width: 8
No. of Terminals: 228
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
No. of DMA Channels: 16
Address Bus Width: 26
Technology: CMOS
RAM Words: 69632
JESD-30 Code: S-PBGA-B228
Maximum Clock Frequency: 48 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: TFBGA
Width: 11 mm
Speed: 600 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.21 V
No. of External Interrupts: 1
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA228,16X16,26
Length: 11 mm
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
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