Microchip Technology - SAM9X60D1G-I/4FB

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SAM9X60D1G-I/4FB by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number SAM9X60D1G-I/4FB
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 233; Package Code: TFBGA; Package Shape: RECTANGULAR;
Datasheet SAM9X60D1G-I/4FB Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.2 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
On Chip Data RAM Width: 8
No. of Terminals: 233
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
No. of DMA Channels: 16
Address Bus Width: 6
Technology: CMOS
RAM Words: 69632
JESD-30 Code: R-PBGA-B233
Maximum Clock Frequency: 50 MHz
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 14 mm
Moisture Sensitivity Level (MSL): 3
Speed: 600 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.9 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 16
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA233,17X17,32
Length: 14 mm
Additional Features: 1-Gbit DDR2--SDRAM AVAILABLE
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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