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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | SAM9X60D6K-I/4GB |
| Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: RECTANGULAR; |
| Datasheet | SAM9X60D6K-I/4GB Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.7 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.2 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| On Chip Data RAM Width: | 8 |
| No. of Terminals: | 196 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| No. of DMA Channels: | 16 |
| Address Bus Width: | 6 |
| Technology: | CMOS |
| RAM Words: | 69632 |
| JESD-30 Code: | R-PBGA-B196 |
| Maximum Clock Frequency: | 50 MHz |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 11 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 600 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.9 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 16 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Package Equivalence Code: | BGA196,16X16,25 |
| Length: | 11 mm |
| Additional Features: | 64-Mbit DDR2--SDRAM AVAILABLE |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | INDUSTRIAL |
