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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | SST26VF032B-104I/TD |
| Description | EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Finish: TIN SILVER COPPER; |
| Datasheet | SST26VF032B-104I/TD Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .000045 Amp |
| Organization: | 4MX8 |
| Maximum Seated Height: | 1.2 mm |
| Programming Voltage (V): | 3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 30 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 24 |
| Maximum Clock Frequency (fCLK): | 104 MHz |
| No. of Words: | 4194304 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Screening Level: | AEC-Q100 |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | TBGA |
| Width: | 6 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Serial Bus Type: | SPI |
| No. of Ports: | 1 |
| Memory Density: | 33554432 bit |
| Memory IC Type: | EEPROM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA24,4X6,40 |
| Length: | 8 mm |
| No. of Words Code: | 4M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Minimum Data Retention Time: | 100 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3/3.3 |
