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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | SY55855VKG |
| Description | PECL TO LVDS TRANSLATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE; |
| Datasheet | SY55855VKG Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.1 mm |
| Output Latch/Register: | NONE |
| Surface Mount: | YES |
| Maximum Supply Current: | 80 mA |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| No. of Terminals: | 10 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| JESD-30 Code: | S-PDSO-G10 |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TSSOP |
| Interface IC Type: | PECL TO LVDS TRANSLATOR |
| Width: | 3 mm |
| Moisture Sensitivity Level (MSL): | 2 |
| No. of Bits: | 1 |
| Output Polarity: | COMPLEMENTARY |
| Maximum Supply Voltage: | 5.7 V |
| Maximum Delay: | .7 ns |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 2 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP10,.19,20 |
| Length: | 3 mm |
| Additional Features: | CML-TO-LVDS TRANSLATION ALSO POSSIBLE |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
