Microchip Technology - U1AFS600-FGG256

U1AFS600-FGG256 by Microchip Technology

Image shown is a representation only.

Manufacturer Microchip Technology
Manufacturer's Part Number U1AFS600-FGG256
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
Datasheet U1AFS600-FGG256 Datasheet
In Stock221
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 600000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.7 mm
No. of Inputs: 159
Surface Mount: Yes
No. of Outputs: 159
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 600000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B256
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of Logic Cells: 13824
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 17 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
221 - -

Popular Products

Category Top Products