Microchip Technology - VSC8484YJP

VSC8484YJP by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number VSC8484YJP
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
Datasheet VSC8484YJP Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: 2.74 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 324
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 18.6 mm
JESD-30 Code: S-PBGA-B324
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Width: 18.6 mm
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
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