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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | VSC8484YJP |
Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | VSC8484YJP Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.2 V |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | 2.74 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 324 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Length: | 18.6 mm |
JESD-30 Code: | S-PBGA-B324 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | BGA |
Width: | 18.6 mm |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |