
Image shown is a representation only.
Manufacturer | Microchip Technology |
---|---|
Manufacturer's Part Number | WP32C2W6NFEI-400B2 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS; |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
No. of Terminals: | 896 |
Package Equivalence Code: | BGA896(UNSPEC) |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B896 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | BGA |