Micron Technology - EDB4432BBBJ-1DAUT-F-D

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EDB4432BBBJ-1DAUT-F-D by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number EDB4432BBBJ-1DAUT-F-D
Description LPDDR2 DRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
Datasheet EDB4432BBBJ-1DAUT-F-D Datasheet
In Stock168
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 128MX32
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: .75 mm
Access Mode: SINGLE BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.14 V
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 134
No. of Words: 134217728 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B134
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: VFBGA
Width: 10 mm
No. of Ports: 1
Memory Density: 4294967296 bit
Self Refresh: YES
Memory IC Type: LPDDR2 DRAM
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Memory Width: 32
No. of Functions: 1
Length: 11.5 mm
No. of Words Code: 128M
Nominal Supply Voltage / Vsup (V): 1.2
Additional Features: AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 1.95 V
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