EDW1032BABG-40-F by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	EDW1032BABG-40-F
Description	DDR5 DRAM; Temperature Grade: OTHER; No. of Terminals: 170; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
Datasheet	EDW1032BABG-40-F Datasheet
In Stock	2,244

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	32MX32
Output Characteristics:	3-STATE
Sub-Category:	DRAMs
Surface Mount:	YES
No. of Terminals:	170
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B170
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	95 Cel
Package Code:	FBGA
Input/Output Type:	COMMON
Memory Density:	1073741824 bit
Sequential Burst Length:	8
Memory IC Type:	DDR5 DRAM
Minimum Operating Temperature:	0 Cel
Memory Width:	32
Qualification:	Not Qualified
Package Equivalence Code:	BGA170,14X17,32
Refresh Cycles:	8192
Alternate Memory Width:	16
Interleaved Burst Length:	8
No. of Words Code:	32M
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Power Supplies (V):	1.35/1.5

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,244	-	-

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RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;

D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;

NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;

RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;

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