Micron Technology - GE28F128L30T85

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GE28F128L30T85 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number GE28F128L30T85
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
Datasheet GE28F128L30T85 Datasheet
In Stock1,685
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000075 Amp
Organization: 8MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 51 mA
Command User Interface: YES
No. of Terminals: 56
No. of Words: 8388608 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B56
No. of Sectors/Size: 4,127
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Boot Block: TOP
Memory Density: 134217728 bit
Sector Size (Words): 16K,64K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Page Size (words): 4
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA56,7X8,30
Common Flash Interface: YES
Maximum Access Time: 85 ns
No. of Words Code: 8M
Parallel or Serial: PARALLEL
Terminal Pitch: .75 mm
Temperature Grade: INDUSTRIAL
Data Polling: NO
Power Supplies (V): 1.8,2.5/3
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