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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | GE28F128W30BC90 |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: FBGA; Package Shape: RECTANGULAR; Memory Width: 16; |
| Datasheet | GE28F128W30BC90 Datasheet |
| In Stock | 2,372 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .000005 Amp |
| Organization: | 8MX16 |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 40 mA |
| Command User Interface: | YES |
| No. of Terminals: | 60 |
| No. of Words: | 8388608 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B60 |
| No. of Sectors/Size: | 8, 255 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Boot Block: | BOTTOM |
| Memory Density: | 134217728 bit |
| Sector Size (Words): | 4K,32K |
| Toggle Bit: | NO |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 16 |
| Page Size (words): | 4 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA60,9X10,30 |
| Common Flash Interface: | YES |
| Maximum Access Time: | 90 ns |
| No. of Words Code: | 8M |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .75 mm |
| Temperature Grade: | INDUSTRIAL |
| Data Polling: | NO |
| Power Supplies (V): | 1.8,3 |
