Micron Technology - GE28F256L18T85

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GE28F256L18T85 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number GE28F256L18T85
Description FLASH; Temperature Grade: OTHER; No. of Terminals: 79; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Words: 16777216 words;
Datasheet GE28F256L18T85 Datasheet
In Stock875
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00011 Amp
Organization: 16MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 27 mA
Command User Interface: YES
No. of Terminals: 79
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B79
No. of Sectors/Size: 4,255
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Boot Block: TOP
Memory Density: 268435456 bit
Sector Size (Words): 16K,64K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -25 Cel
Memory Width: 16
Page Size (words): 4
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA79,7X13,30
Common Flash Interface: YES
Maximum Access Time: 85 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 1.8
Parallel or Serial: PARALLEL
Terminal Pitch: .75 mm
Temperature Grade: OTHER
Data Polling: NO
Power Supplies (V): 1.8
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