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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | JZ58F0085M0Y0GF |
| Description | MEMORY CIRCUIT; No. of Terminals: 104; Package Code: VFBGA; Package Shape: SQUARE; Memory Density: 536870912 bit; No. of Functions: 1; |
| Datasheet | JZ58F0085M0Y0GF Datasheet |
| In Stock | 2,480 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 32MX16 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .9 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Surface Mount: | YES |
| No. of Terminals: | 104 |
| No. of Words: | 33554432 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B104 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Package Code: | VFBGA |
| Width: | 10 mm |
| Memory Density: | 536870912 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Length: | 10 mm |
| No. of Words Code: | 32M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | PSRAM DIE DENSITY-128 MBIT |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Maximum Supply Voltage (Vsup): | 1.95 V |
