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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | JZ58F0112M0Q0GE |
| Description | MEMORY CIRCUIT; No. of Terminals: 104; Package Code: TFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30; Maximum Seated Height: 1.1 mm; |
| Datasheet | JZ58F0112M0Q0GE Datasheet |
| In Stock | 627 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 64MX16 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.1 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Surface Mount: | YES |
| No. of Terminals: | 104 |
| No. of Words: | 67108864 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B104 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Package Code: | TFBGA |
| Width: | 10 mm |
| Memory Density: | 1073741824 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Length: | 10 mm |
| No. of Words Code: | 64M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | PSRAM DIE DENSITY-256 MBIT |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Maximum Supply Voltage (Vsup): | 1.95 V |
