M25PX32SOVZM6EB by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	M25PX32SOVZM6EB
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA24,5X5,40;
Datasheet	M25PX32SOVZM6EB Datasheet
In Stock	2,394

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00001 Amp
Organization:	4MX8
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	15 mA
No. of Terminals:	24
Maximum Clock Frequency (fCLK):	75 MHz
No. of Words:	4194304 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Write Protection:	HARDWARE/SOFTWARE
Technology:	CMOS
JESD-30 Code:	S-PBGA-B24
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Endurance:	100000 Write/Erase Cycles
Package Code:	BGA
Serial Bus Type:	SPI
Memory Density:	33554432 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA24,5X5,40
No. of Words Code:	4M
Minimum Data Retention Time:	20
Parallel or Serial:	SERIAL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	3/3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,394	-	-

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