Image shown is a representation only.
| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | M25PX64SOVZM3PA |
| Description | FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 24; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B24; |
| Datasheet | M25PX64SOVZM3PA Datasheet |
| In Stock | 91 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00001 Amp |
| Organization: | 8MX8 |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 15 mA |
| No. of Terminals: | 24 |
| Maximum Clock Frequency (fCLK): | 75 MHz |
| No. of Words: | 8388608 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B24 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | BGA |
| Serial Bus Type: | SPI |
| Memory Density: | 67108864 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA24,5X5,40 |
| No. of Words Code: | 8M |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 3/3.3 |
