Micron Technology - M29DW256G70N6E

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M29DW256G70N6E by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number M29DW256G70N6E
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
Datasheet M29DW256G70N6E Datasheet
In Stock264
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0001 Amp
Organization: 16MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 10 mA
Command User Interface: YES
No. of Terminals: 56
No. of Words: 16777216 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G56
No. of Sectors/Size: 8,126
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Boot Block: BOTTOM/TOP
Memory Density: 268435456 bit
Sector Size (Words): 32K,128K
Toggle Bit: YES
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: TSSOP56,.8,20
Common Flash Interface: YES
Maximum Access Time: 70 ns
No. of Words Code: 16M
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Data Polling: YES
Power Supplies (V): 3/3.3
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