M29DW256G70ZS1F by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	M29DW256G70ZS1F
Description	FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
Datasheet	M29DW256G70ZS1F Datasheet
In Stock	674

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.0001 Amp
Organization:	16MX16
Programming Voltage (V):	3
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	10 mA
Command User Interface:	YES
No. of Terminals:	64
No. of Words:	16777216 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B64
No. of Sectors/Size:	8,126
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Boot Block:	BOTTOM/TOP
Memory Density:	268435456 bit
Sector Size (Words):	32K,128K
Toggle Bit:	YES
Memory IC Type:	FLASH
Minimum Operating Temperature:	0 Cel
Memory Width:	16
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA64,8X8,40
Common Flash Interface:	YES
Maximum Access Time:	70 ns
No. of Words Code:	16M
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Data Polling:	YES
Power Supplies (V):	3/3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
674	-	-

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;

TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

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RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;

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