Micron Technology - M29F800FB5AZA6F-2

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M29F800FB5AZA6F-2 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number M29F800FB5AZA6F-2
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet M29F800FB5AZA6F-2 Datasheet
In Stock2,028
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00012 Amp
Organization: 512KX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 30 mA
Command User Interface: YES
No. of Terminals: 48
No. of Words: 524288 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: R-PBGA-B48
No. of Sectors/Size: 1,2,1,15
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Boot Block: BOTTOM
Memory Density: 8388608 bit
Sector Size (Words): 16K,8K,32K,64K
Toggle Bit: YES
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA48,6X8,32
Alternate Memory Width: 8
Common Flash Interface: YES
Maximum Access Time: 55 ns
No. of Words Code: 512K
Nominal Supply Voltage / Vsup (V): 5
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Data Polling: YES
Power Supplies (V): 5
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Pricing (USD)

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