Micron Technology - M29W160EB80ZS3SE

M29W160EB80ZS3SE by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number M29W160EB80ZS3SE
Description FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
Datasheet M29W160EB80ZS3SE Datasheet
In Stock348
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0001 Amp
Organization: 1MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 10 mA
Command User Interface: YES
No. of Terminals: 64
No. of Words: 1048576 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B64
No. of Sectors/Size: 1,2,1,31
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Boot Block: BOTTOM
Memory Density: 16777216 bit
Sector Size (Words): 16K,8K,32K,64K
Toggle Bit: YES
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA64,8X8,40
Alternate Memory Width: 8
Common Flash Interface: YES
Maximum Access Time: 80 ns
No. of Words Code: 1M
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Data Polling: YES
Power Supplies (V): 3/3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
348 - -

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