Micron Technology - M29W160FB80N3E6

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M29W160FB80N3E6 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number M29W160FB80N3E6
Description FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
Datasheet M29W160FB80N3E6 Datasheet
In Stock1,356
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0001 Amp
Organization: 1MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 10 mA
Command User Interface: YES
No. of Terminals: 48
No. of Words: 1048576 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G48
No. of Sectors/Size: 1,2,1,31
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: TSSOP
Boot Block: BOTTOM
Memory Density: 16777216 bit
Sector Size (Words): 16K,8K,32K,64K
Toggle Bit: YES
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: TSSOP48,.8,20
Alternate Memory Width: 8
Common Flash Interface: YES
Maximum Access Time: 80 ns
No. of Words Code: 1M
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
Data Polling: YES
Power Supplies (V): 2.7/3.3
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