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Manufacturer | Micron Technology |
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Manufacturer's Part Number | PC28F256P30BFE |
Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 2 V; |
Datasheet | PC28F256P30BFE Datasheet |
In Stock | 887 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Programming Voltage (V): | 1.8 |
Minimum Supply Voltage (Vsup): | 1.7 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Technology: | CMOS |
No. of Sectors/Size: | 4,255 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Package Code: | TBGA |
Toggle Bit: | NO |
Memory Width: | 16 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA64,8X8,40 |
Additional Features: | ASYNCHRONOUS READ MODE |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1 mm |
Maximum Standby Current: | .00021 Amp |
Organization: | 16MX16 |
Maximum Seated Height: | 1.2 mm |
Maximum Supply Current: | 31 mA |
Command User Interface: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 64 |
No. of Words: | 16777216 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE |
JESD-30 Code: | R-PBGA-B64 |
Maximum Operating Temperature: | 85 Cel |
Width: | 10 mm |
Boot Block: | BOTTOM |
Memory Density: | 268435456 bit |
Sector Size (Words): | 16K,64K |
Memory IC Type: | FLASH |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Type: | NOR TYPE |
Common Flash Interface: | YES |
Length: | 13 mm |
Maximum Access Time: | 100 ns |
No. of Words Code: | 16M |
Nominal Supply Voltage / Vsup (V): | 1.8 |
Parallel or Serial: | PARALLEL |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 2 V |
Data Polling: | NO |
Power Supplies (V): | 1.8,1.8/3.3 |