Micron Technology - M29W256GH70ZA3F

M29W256GH70ZA3F by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number M29W256GH70ZA3F
Description FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
Datasheet M29W256GH70ZA3F Datasheet
In Stock1,229
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX16
Maximum Seated Height: 1.2 mm
Programming Voltage (V): 3
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 64
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B64
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: TBGA
Width: 10 mm
Boot Block: BOTTOM/TOP
Memory Density: 268435456 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Type: NOR TYPE
Alternate Memory Width: 8
Length: 13 mm
Maximum Access Time: 70 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 3
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 3.6 V
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Pricing (USD)

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