Micron Technology - M39L0R8090U3ZE6E

M39L0R8090U3ZE6E by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number M39L0R8090U3ZE6E
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 133; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;
Datasheet M39L0R8090U3ZE6E Datasheet
In Stock742
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32MX16
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 133
No. of Words: 33554432 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B133
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: 8 mm
Memory Density: 536870912 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Length: 8 mm
No. of Words Code: 32M
Nominal Supply Voltage / Vsup (V): 1.8
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.95 V
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