Micron Technology - M58BW016FT8ZA3T

M58BW016FT8ZA3T by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number M58BW016FT8ZA3T
Description FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: BGA; Package Shape: RECTANGULAR; Data Polling: NO;
Datasheet M58BW016FT8ZA3T Datasheet
In Stock1,474
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000005 Amp
Organization: 512KX32
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 40 mA
Command User Interface: YES
No. of Terminals: 80
No. of Words: 524288 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: R-PBGA-B80
No. of Sectors/Size: 8,31
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Boot Block: TOP
Memory Density: 16777216 bit
Sector Size (Words): 2K,16K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 32
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA80,8X10,40
Common Flash Interface: YES
Maximum Access Time: 80 ns
No. of Words Code: 512K
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
Data Polling: NO
Power Supplies (V): 2.5/3.3,3/3.3
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Pricing (USD)

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