Micron Technology - M58WR064HU70ZA6U

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M58WR064HU70ZA6U by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number M58WR064HU70ZA6U
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: LBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
Datasheet M58WR064HU70ZA6U Datasheet
In Stock169
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4MX16
Maximum Seated Height: 1.6 mm
Programming Voltage (V): 1.8
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 80
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B80
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: LBGA
Width: 10 mm
Boot Block: TOP
Memory Density: 67108864 bit
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Type: NOR TYPE
Qualification: Not Qualified
Length: 12 mm
No. of Words Code: 4M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 2 V
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