Micron Technology - M58WT032KB70ZAQ6E

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M58WT032KB70ZAQ6E by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number M58WT032KB70ZAQ6E
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: FBGA; Package Shape: RECTANGULAR; Sector Size (Words): 4K,32K;
Datasheet M58WT032KB70ZAQ6E Datasheet
In Stock2,297
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00005 Amp
Organization: 2MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 70 mA
Command User Interface: YES
No. of Terminals: 88
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B88
No. of Sectors/Size: 8,63
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Boot Block: BOTTOM
Memory Density: 33554432 bit
Sector Size (Words): 4K,32K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Page Size (words): 4
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA88,8X12,32
Common Flash Interface: YES
Maximum Access Time: 70 ns
No. of Words Code: 2M
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Data Polling: NO
Power Supplies (V): 1.8,3
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Pricing (USD)

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