Micron Technology - MT16HTS51264HY-800A1

  1. Home
  2. Micron Technology - MT16HTS51264HY-800A1
MT16HTS51264HY-800A1 by Micron Technology

Image shown is a representation only.

Manufacturer Micron Technology
Manufacturer's Part Number MT16HTS51264HY-800A1
Description DRAMs;
Datasheet MT16HTS51264HY-800A1 Datasheet
In Stock644
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
644 - -

Popular Products

Category Top Products

W631GU6NB-12 by Winbond Electronics

W631GU6NB-12

Winbond Electronics

W631GU6NB-12 by Winbond Electronics is a DDR3L DRAM with 64MX16 organization, operating at up to 800 MHz. It features a low supply voltage of 1.35V and offers a memory density of 1073741824 bits. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
M378A1K43CB2-CRC by Samsung

M378A1K43CB2-CRC

Samsung

Samsung M378A1K43CB2-CRC DDR4 DRAM Module features 1GX64 organization, operates at 1200 MHz clock frequency, and has a memory width of 64. Ideal for high-performance computing applications requiring synchronous operation and common I/O type with self-refresh capability.
MT47H128M16HG-3IT by Micron Technology

MT47H128M16HG-3IT

Micron Technology

Micron Technology's MT47H128M16HG-3IT is a DDR2 DRAM with 128MX16 organization, operating at 1.8V. It features synchronous operation, self-refresh capability, and industrial temperature grade suitability. Ideal for applications requiring high memory density and fast access times in industrial environments.
AS4C256M16D3LC-12BIN by Alliance Memory

AS4C256M16D3LC-12BIN

Alliance Memory

Alliance Memory's AS4C256M16D3LC-12BIN is a 256MX16 DDR3L DRAM with 800 MHz clock frequency. Operating at 1.35V, it offers 8192 refresh cycles and supports multi-bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in a compact form factor.
MT40A1G16KD-062EIT:ETR by Micron Technology

MT40A1G16KD-062EIT:ETR

Micron Technology

Micron Technology's MT40A1G16KD-062EIT:ETR is a DDR4 DRAM with 1GX16 organization, operating at 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Suitable for applications requiring high-speed memory access in devices like computers and servers.
AS4C256M16D3B-12BIN by Alliance Memory

AS4C256M16D3B-12BIN

Alliance Memory

Alliance Memory's AS4C256M16D3B-12BIN is a 256MX16 DDR3 DRAM with synchronous operation and self-refresh capability. Featuring a package style of GRID ARRAY, it has a memory density of 4294967296 bit and operates at temperatures ranging from 0 to 85 °C. Ideal for applications requiring high-speed data storage and retrieval in compact electronic devices.
MT48LC8M16A2TG-75IT:GTR by Micron Technology

MT48LC8M16A2TG-75IT:GTR

Micron Technology

Micron Technology's MT48LC8M16A2TG-75IT:GTR is a 3.3V, 8MX16 Synchronous DRAM with 8388608 words and 134217728 bit memory density. Operating in industrial temperature range, it features self-refresh capability and offers fast access time of 5.4 ns. Ideal for applications requiring high-speed data processing and reliable memory performance.
K4D263238F-QC50 by Samsung

K4D263238F-QC50

Samsung

Samsung's K4D263238F-QC50 is a DDR1 DRAM with 4MX32 organization and 32 memory width. Operating at 200 MHz, it offers a max clock frequency and supports synchronous mode for common I/O type applications. With self-refresh capability and thin profile packaging, it is ideal for commercial-grade systems requiring fast access times.
S70KS1282GABHV020 by Infineon Technologies

S70KS1282GABHV020

Infineon Technologies

Infineon's S70KS1282GABHV020 is a 16MX8 DRAM with 200 MHz clock frequency, 1.8V supply voltage, and 105°C operating temp. Ideal for applications requiring high-speed synchronous memory in compact devices due to its low profile grid array package and common I/O type.
KM44C256CP-7 by Samsung

KM44C256CP-7

Samsung

Samsung's KM44C256CP-7 is a 256Kx4 DRAM with 70ns access time, operating at 5V. It features a 3-STATE output and fast page access mode. Ideal for commercial applications requiring high-speed memory with a memory density of 1048576 bits.
KM44C256BP-7 by Samsung

KM44C256BP-7

Samsung

Samsung's KM44C256BP-7 is a 256Kx4 DRAM with 262144 words and memory density of 1048576 bits. Operating at 5V, it has a max access time of 70ns and refresh cycles of 512. Ideal for applications requiring fast page access in commercial temperature grades.
K4S281632K-UC75 by Samsung

K4S281632K-UC75

Samsung

Samsung's K4S281632K-UC75 is a 8MX16 DRAM with 133 MHz clock frequency, suitable for commercial applications. Features include 3.3V supply voltage, 70°C operating temperature, and 4096 refresh cycles. Ideal for systems requiring high-speed synchronous memory with low power consumption.
LH64256BK-70 by Sharp Corporation

LH64256BK-70

Sharp Corporation

LH64256BK-70 by Sharp Corp is a 256Kx4 DRAM with 512 refresh cycles, operating at 70ns access time. It features a CMOS technology, 3-STATE output characteristics, and operates in FAST PAGE mode. Ideal for commercial applications requiring high-speed memory with a memory density of 1048576 bits.
MT53D1024M32D4DT-046WT:D by Micron Technology

MT53D1024M32D4DT-046WT:D

Micron Technology

Micron Technology's MT53D1024M32D4DT-046WT:D is a LPDDR4 DRAM with 1GX32 organization, 1073741824 words capacity, and 2136.7 MHz clock frequency. It operates synchronously at 1.8V for applications requiring high-speed memory access in compact devices like smartphones and tablets.
MT46H128M32L2MC-5WT:B by Micron Technology

MT46H128M32L2MC-5WT:B

Micron Technology

Micron Technology's MT46H128M32L2MC-5WT:B is a DDR1 DRAM with 128MX32 organization, operating at 200 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices with limited space and power constraints.
IS42S16400J-6BLI by Integrated Silicon Solution

IS42S16400J-6BLI

Integrated Silicon Solution

IS42S16400J-6BLI by Integrated Silicon Solution is a 4MX16 Synchronous DRAM with a max clock frequency of 166 MHz. It operates in an industrial temperature grade range and has a memory density of 67108864 bits. This memory IC type is commonly used in applications requiring high-speed data storage and retrieval.
AS4C256M16D3LC-12BANTR by Alliance Memory

AS4C256M16D3LC-12BANTR

Alliance Memory

Alliance Memory's AS4C256M16D3LC-12BANTR is a 256MX16 DDR3L DRAM with 800 MHz clock frequency, 1.35V supply voltage, and 105°C operating temperature. Ideal for automotive applications due to AEC-Q100 screening level and common I/O type in a compact grid array package.
NT5TU64M16DG-3C by Nanya Technology

NT5TU64M16DG-3C

Nanya Technology

NT5TU64M16DG-3C by Nanya Technology is a DDR2 DRAM with 64MX16 organization, operating at 333 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access such as servers, workstations, and networking equipment.
MT47H32M16NF-25E:HTR by Micron Technology

MT47H32M16NF-25E:HTR

Micron Technology

Micron Technology's MT47H32M16NF-25E:HTR is a DDR2 DRAM with 32MX16 organization, 400 MHz clock frequency, and 1.8V nominal voltage. It is used in applications requiring high-speed synchronous operation, such as servers, networking equipment, and industrial automation systems.
M378B5673EH1-CH9 by Samsung

M378B5673EH1-CH9

Samsung

Samsung M378B5673EH1-CH9 DDR DRAM features 256MX64 organization, operates at 667 MHz with 3-STATE output. Suitable for high-performance computing applications due to its synchronous operation and self-refresh capability.