Micron Technology - MT28F322D20FH-10TET

MT28F322D20FH-10TET by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT28F322D20FH-10TET
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 58; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B58;
Datasheet MT28F322D20FH-10TET Datasheet
In Stock796
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2MX16
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.8 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 58
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B58
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 7 mm
Memory Density: 33554432 bit
Memory IC Type: MEMORY CIRCUIT
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Length: 12 mm
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 2
Terminal Pitch: .75 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 2.2 V
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