Micron Technology - MT29C8G96MAZBADKD-5WT

MT29C8G96MAZBADKD-5WT by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT29C8G96MAZBADKD-5WT
Description MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
Datasheet MT29C8G96MAZBADKD-5WT Datasheet
In Stock1,106
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64MX32
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.1 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 137
No. of Words: 67108864 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B137
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 10.5 mm
Memory Density: 2147483648 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -25 Cel
Memory Width: 32
No. of Functions: 1
Length: 13 mm
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: ALSO ORGANISED AS 128M X 16
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 1.95 V
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