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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT29F256G08AUCABH3-10Z |
| Description | FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Programming Voltage (V): 3.3; |
| Datasheet | MT29F256G08AUCABH3-10Z Datasheet |
| In Stock | 1,898 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 32GX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1.65 mm |
| Programming Voltage (V): | 3.3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 50 mA |
| No. of Terminals: | 100 |
| No. of Words: | 34359738368 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B100 |
| No. of Sectors/Size: | 32K |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS/SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 12 mm |
| Memory Density: | 274877906944 bit |
| Sector Size (Words): | 1M |
| Toggle Bit: | YES |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| Page Size (words): | 8K |
| No. of Functions: | 1 |
| Type: | SLC NAND TYPE |
| Package Equivalence Code: | BGA100,10X17,40 |
| Length: | 18 mm |
| Maximum Access Time: | 20 ns |
| No. of Words Code: | 32G |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | SEATED HGT_CALCULATED |
| Ready or Busy: | YES |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Reverse Pinout: | NO |
