Micron Technology - MT29F256G08CKAAAH3Z:A

MT29F256G08CKAAAH3Z:A by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT29F256G08CKAAAH3Z:A
Description FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LBGA; Package Shape: RECTANGULAR; Memory Density: 274877906944 bit;
Datasheet MT29F256G08CKAAAH3Z:A Datasheet
In Stock1,405
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32GX8
Maximum Seated Height: 1.4 mm
Programming Voltage (V): 2.7
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 100
No. of Words: 34359738368 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B100
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: LBGA
Width: 12 mm
Memory Density: 274877906944 bit
Memory IC Type: FLASH
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Type: MLC NAND TYPE
Length: 18 mm
No. of Words Code: 32G
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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Pricing (USD)

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