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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT29F2G01ABAGD12-AAT:G |
| Description | FLASH; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V; Terminal Position: BOTTOM; |
| Datasheet | MT29F2G01ABAGD12-AAT:G Datasheet |
| In Stock | 437 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 256MX8 |
| Maximum Seated Height: | 1.2 mm |
| Programming Voltage (V): | 3.3 |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 35 mA |
| No. of Terminals: | 24 |
| Maximum Clock Frequency (fCLK): | 133 MHz |
| No. of Words: | 268435456 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 105 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | TBGA |
| Width: | 6 mm |
| Serial Bus Type: | SPI |
| Memory Density: | 2147483648 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | SLC NAND TYPE |
| Package Equivalence Code: | BGA24,5X5,40 |
| Length: | 8 mm |
| No. of Words Code: | 256M |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Minimum Data Retention Time: | 10 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1 mm |
| Maximum Supply Voltage (Vsup): | 3.6 V |
