MT29F32G08ABCABH1-10Z:A by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	MT29F32G08ABCABH1-10Z:A
Description	FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Toggle Bit: NO;
Datasheet	MT29F32G08ABCABH1-10Z:A Datasheet
In Stock	1,220

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00001 Amp
Organization:	4GX8
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	50 mA
Command User Interface:	YES
No. of Terminals:	100
No. of Words:	4294967296 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B100
No. of Sectors/Size:	4K
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Memory Density:	34359738368 bit
Sector Size (Words):	1M
Toggle Bit:	NO
Memory IC Type:	FLASH
Minimum Operating Temperature:	0 Cel
Memory Width:	8
Page Size (words):	8K
Type:	SLC NAND TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA100,10X17,40
Maximum Access Time:	20 ns
No. of Words Code:	4G
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Data Polling:	NO
Power Supplies (V):	1.8,3/3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,220	-	-

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