Micron Technology - MT29F32G08CBACAWP-Z:C

MT29F32G08CBACAWP-Z:C by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT29F32G08CBACAWP-Z:C
Description FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
Datasheet MT29F32G08CBACAWP-Z:C Datasheet
In Stock230
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4GX8
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.2 mm
Programming Voltage (V): 3.3
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 48
No. of Words: 4294967296 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PDSO-G48
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TSOP1
Width: 12 mm
Memory Density: 34359738368 bit
Memory IC Type: FLASH
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Type: MLC NAND TYPE
Length: 18.4 mm
No. of Words Code: 4G
Nominal Supply Voltage / Vsup (V): 3.3
Peak Reflow Temperature (C): 260
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
Plant 5!
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Pricing (USD)

Qty. Unit Price Ext. Price
230 - -

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