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Manufacturer | Micron Technology |
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Manufacturer's Part Number | MT29F4G01AAADDHC:D |
Description | FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 50 MHz; |
Datasheet | MT29F4G01AAADDHC:D Datasheet |
In Stock | 701 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .00005 Amp |
Organization: | 512MX8 |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Maximum Supply Current: | 20 mA |
No. of Terminals: | 63 |
Maximum Clock Frequency (fCLK): | 50 MHz |
No. of Words: | 536870912 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Write Protection: | HARDWARE |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B63 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Endurance: | 100000 Write/Erase Cycles |
Package Code: | FBGA |
Serial Bus Type: | SPI |
Memory Density: | 4294967296 bit |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 8 |
Type: | SLC NAND TYPE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA63,10X12,32 |
No. of Words Code: | 512M |
Minimum Data Retention Time: | 10 |
Parallel or Serial: | SERIAL |
Terminal Pitch: | .8 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 3/3.3 |