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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT29F4G01AAADDHC:D |
| Description | FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 50 MHz; |
| Datasheet | MT29F4G01AAADDHC:D Datasheet |
| In Stock | 701 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 512MX8 |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 20 mA |
| No. of Terminals: | 63 |
| Maximum Clock Frequency (fCLK): | 50 MHz |
| No. of Words: | 536870912 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Write Protection: | HARDWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B63 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | FBGA |
| Serial Bus Type: | SPI |
| Other Names: |
112811 2832-MT29F4G01AAADDHC:D -MT29F4G01AAADDHC:D |
| Memory Density: | 4294967296 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| Type: | SLC NAND TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA63,10X12,32 |
| No. of Words Code: | 512M |
| Minimum Data Retention Time: | 10 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 3/3.3 |
