Micron Technology - MT29F512G08CKCCBH7-6R:C

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MT29F512G08CKCCBH7-6R:C by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT29F512G08CKCCBH7-6R:C
Description FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 152; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 549755813888 bit;
Datasheet MT29F512G08CKCCBH7-6R:C Datasheet
In Stock753
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64GX8
Maximum Seated Height: 1.2 mm
Programming Voltage (V): 3.3
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 152
No. of Words: 68719476736 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B152
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS/ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: TBGA
Width: 14 mm
Memory Density: 549755813888 bit
Memory IC Type: FLASH
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Type: MLC NAND TYPE
Length: 18 mm
No. of Words Code: 64G
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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