Micron Technology - MT29F64G08AECABH1-10ITZ:A

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MT29F64G08AECABH1-10ITZ:A by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT29F64G08AECABH1-10ITZ:A
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words Code: 8G;
Datasheet MT29F64G08AECABH1-10ITZ:A Datasheet
In Stock200
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00001 Amp
Organization: 8GX8
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 50 mA
Command User Interface: YES
No. of Terminals: 100
No. of Words: 8589934592 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B100
No. of Sectors/Size: 8K
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Memory Density: 68719476736 bit
Sector Size (Words): 1M
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
Page Size (words): 8K
Type: SLC NAND TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA100,10X17,40
Maximum Access Time: 20 ns
No. of Words Code: 8G
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Data Polling: NO
Power Supplies (V): 1.8,3/3.3
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