Micron Technology - MT29F8G08ABACAH4-IT:C

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MT29F8G08ABACAH4-IT:C by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT29F8G08ABACAH4-IT:C
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA63,10X12,32;
Datasheet MT29F8G08ABACAH4-IT:C Datasheet
In Stock1,422
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0001 Amp
Organization: 1GX8
Maximum Seated Height: 1 mm
Minimum Supply Voltage (Vsup): 2.7 V
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 35 mA
Command User Interface: YES
No. of Terminals: 63
No. of Words: 1073741824 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B63
No. of Sectors/Size: 4K
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 9 mm
Memory Density: 8589934592 bit
Sector Size (Words): 256K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 8
Page Size (words): 4K
No. of Functions: 1
Type: SLC NAND TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA63,10X12,32
Length: 11 mm
No. of Words Code: 1G
Nominal Supply Voltage / Vsup (V): 3.3
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
Data Polling: NO
Power Supplies (V): 3/3.3
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