Micron Technology - MT29F8G08ABCBBH1-12:B

MT29F8G08ABCBBH1-12:B by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT29F8G08ABCBBH1-12:B
Description FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
Datasheet MT29F8G08ABCBBH1-12:B Datasheet
In Stock798
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00005 Amp
Organization: 1GX8
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 50 mA
Command User Interface: YES
No. of Terminals: 100
No. of Words: 1073741824 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B100
No. of Sectors/Size: 2K
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Memory Density: 8589934592 bit
Sector Size (Words): 512K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: 0 Cel
Memory Width: 8
Page Size (words): 4K
Type: SLC NAND TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA100,10X17,40
Maximum Access Time: 20 ns
No. of Words Code: 1G
Nominal Supply Voltage / Vsup (V): 1.8
Ready or Busy: YES
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Data Polling: NO
Power Supplies (V): 1.8
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Pricing (USD)

Qty. Unit Price Ext. Price
798 - -

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