Micron Technology - MT38L3021A902ZQXZI.X79

MT38L3021A902ZQXZI.X79 by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MT38L3021A902ZQXZI.X79
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
Datasheet MT38L3021A902ZQXZI.X79 Datasheet
In Stock947
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 8MX16
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 88
No. of Words: 8388608 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B88
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 8 mm
Memory Density: 134217728 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Length: 10 mm
No. of Words Code: 8M
Additional Features: IT ALSO CONTAINS 32MBIT(2MBIT X 16) PSRAM
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.95 V
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Pricing (USD)

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