Micron Technology - MT4257MN-12

  1. Home
  2. Micron Technology - MT4257MN-12
MT4257MN-12 by Micron Technology

Image shown is a representation only.

Manufacturer Micron Technology
Manufacturer's Part Number MT4257MN-12
Description NIBBLE MODE DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 22; Refresh Cycles: 512; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Access Time: 120 ns;
Datasheet MT4257MN-12 Datasheet
In Stock1,324
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Input/Output Type: COMMON
Memory Density: 1048576 bit
Organization: 256KX4
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: NO
Memory IC Type: NIBBLE MODE DRAM
Terminal Finish: Tin/Lead (Sn/Pb)
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 4
No. of Terminals: 22
No. of Words: 262144 words
Qualification: Not Qualified
Package Equivalence Code: SIP22,.2
Terminal Position: SINGLE
Refresh Cycles: 512
Technology: CMOS
Maximum Access Time: 120 ns
No. of Words Code: 256K
Maximum Operating Temperature: 70 Cel
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
1,324 - -

Popular Products

Category Top Products

MT41K256M16HA-125AAT by Micron Technology

MT41K256M16HA-125AAT

Micron Technology

Micron Technology's MT41K256M16HA-125AAT is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and multi-bank page burst access. This thin-profile memory module is suitable for applications requiring high-speed data processing in compact devices.
MT41J256M8DA-125:K by Micron Technology

MT41J256M8DA-125:K

Micron Technology

Micron Technology's MT41J256M8DA-125:K is a DDR3 DRAM with 256MX8 organization, operating at 800 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices like computers and servers.
M378T5663RZ3-CF7 by Samsung

M378T5663RZ3-CF7

Samsung

Samsung M378T5663RZ3-CF7 DDR DRAM with 256MX8 organization, 400 MHz clock frequency, and 1.8V supply voltage is ideal for high-speed computing applications. Featuring synchronous operation and self-refresh capability, it offers efficient performance in dual bank page burst access mode.
K4M281633H-BN75 by Samsung

K4M281633H-BN75

Samsung

Samsung's K4M281633H-BN75 DRAM features 8MX16 organization, 16-bit memory width, and 133 MHz clock frequency. Ideal for applications requiring high-speed data processing with a max operating temperature of 85°C. The package style is grid array with fine pitch, making it suitable for compact electronic devices.
MT46H32M16LFBF-6AIT:C by Micron Technology

MT46H32M16LFBF-6AIT:C

Micron Technology

MT46H32M16LFBF-6AIT:C by Micron Technology is a 32MX16 DDR1 DRAM with a memory density of 536870912 bit. It operates at a max clock frequency of 166 MHz and has an operating temperature range of -40 to 85 °C. It is commonly used in industrial applications requiring high-speed synchronous memory.
MT48LC32M16A2TG-75:CTR by Micron Technology

MT48LC32M16A2TG-75:CTR

Micron Technology

Micron Technology's MT48LC32M16A2TG-75:CTR is a 32MX16 Synchronous DRAM with 3.3V supply voltage, operating at 0-70°C. It features 33554432 words, 16-bit memory width, and 536870912 bit memory density. Ideal for applications requiring fast access time and synchronous operation.
MB814400A-70PZ by Fujitsu Semiconductor America

MB814400A-70PZ

Fujitsu Semiconductor America

FAST PAGE DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: ZIP; Refresh Cycles: 1024; Package Shape: RECTANGULAR;
MT53E512M32D1ZW-046AIT:B by Micron Technology

MT53E512M32D1ZW-046AIT:B

Micron Technology

Micron Technology's MT53E512M32D1ZW-046AIT:B is a LPDDR4 DRAM with 512MX32 organization, operating at 2133 MHz. It features self-refresh mode, common I/O type, and AEC-Q100 screening level. Ideal for applications requiring high-speed synchronous memory with low power consumption in automotive electronics and industrial devices.
M392B2G70BM0-YH9 by Samsung

M392B2G70BM0-YH9

Samsung

Samsung M392B2G70BM0-YH9 DRAM features 240 terminals, 1.35V supply, and 667MHz clock frequency. Ideal for servers due to its high memory density of 154618822656 bits and organization of 2GX72, offering fast data processing at temperatures ranging from 0 to 85°C.
MT46V16M16P-6TIT:F by Micron Technology

MT46V16M16P-6TIT:F

Micron Technology

Micron Technology's MT46V16M16P-6TIT:F is a DDR1 DRAM with 16MX16 organization, operating at 167 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
MT8JTF12864HZ-1G6G1 by Micron Technology

MT8JTF12864HZ-1G6G1

Micron Technology

Micron Technology's MT8JTF12864HZ-1G6G1 is a 128MX64 DDR DRAM MODULE with 204 terminals, operating at 800 MHz. It has a memory density of 8589934592 bits and supports a max clock frequency of 800 MHz. Ideal for commercial applications requiring high-speed data processing and storage capabilities.
MT40A512M16LY-062EIT:ETR by Micron Technology

MT40A512M16LY-062EIT:ETR

Micron Technology

Micron Technology's MT40A512M16LY-062EIT:ETR is a DDR4 DRAM with 512MX16 organization, operating at up to 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. This thin-profile memory module is suitable for applications requiring high-speed data processing in a compact form factor.
MT41K256M16TW-107AUT:P by Micron Technology

MT41K256M16TW-107AUT:P

Micron Technology

Micron Technology's MT41K256M16TW-107AUT:P is a DDR3L DRAM with 256MX16 organization, operating at 934.57 MHz clock frequency. Ideal for automotive applications due to AEC-Q100 screening level and wide temperature range (-40 to 125 °C). Features include synchronous operation, self-refresh capability, and common I/O type.
K4D263238F-QC50 by Samsung

K4D263238F-QC50

Samsung

Samsung's K4D263238F-QC50 is a DDR1 DRAM with 4MX32 organization and 32 memory width. Operating at 200 MHz, it offers a max clock frequency and supports synchronous mode for common I/O type applications. With self-refresh capability and thin profile packaging, it is ideal for commercial-grade systems requiring fast access times.
M378T6553CZ3-CD5 by Samsung

M378T6553CZ3-CD5

Samsung

Samsung M378T6553CZ3-CD5 DDR DRAM Module has 64MX64 organization, operates at 267 MHz with 1.8V supply. Ideal for high-performance computing applications due to its synchronous operation and 64M word code capacity.
KMM366S403CTL-G0 by Samsung

KMM366S403CTL-G0

Samsung

Samsung's KMM366S403CTL-G0 is a 4MX64 Synchronous DRAM module with 3.3V supply, operating at 100MHz clock frequency. It features self-refresh capability and offers a memory density of 268MB for applications requiring high-speed data processing in commercial temperature environments.
M366S1654ETS-C7A by Samsung

M366S1654ETS-C7A

Samsung

Samsung's M366S1654ETS-C7A is a 16MX64 synchronous DRAM module with 3.3V supply, operating at up to 133 MHz clock frequency. Ideal for applications requiring high-speed memory access and data processing capabilities in commercial temperature environments.
M378B5673EH1-CH9 by Samsung

M378B5673EH1-CH9

Samsung

Samsung M378B5673EH1-CH9 DDR DRAM features 256MX64 organization, operates at 667 MHz with 3-STATE output. Suitable for high-performance computing applications due to its synchronous operation and self-refresh capability.
MT48LC4M32B2P-6AXIT:LTR by Micron Technology

MT48LC4M32B2P-6AXIT:LTR

Micron Technology

Micron Technology's MT48LC4M32B2P-6AXIT:LTR is a 4MX32 Synchronous DRAM with a memory density of 134217728 bits. It operates at a nominal voltage of 3.3V and has a max access time of 5.4 ns. This memory IC is commonly used in industrial applications requiring high-speed data storage and retrieval.
MT48LC16M16A2P-6AXIT:GTR by Micron Technology

MT48LC16M16A2P-6AXIT:GTR

Micron Technology

Micron Technology's MT48LC16M16A2P-6AXIT:GTR is a 16MX16 Synchronous DRAM with 167 MHz clock frequency, 5.4 ns access time, and 8192 refresh cycles. Ideal for industrial applications requiring high-speed memory operations in a compact form factor.