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Manufacturer | Micron Technology |
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Manufacturer's Part Number | MT44K32M18RB-107E:BTR |
Description | RLDRAM3; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; JESD-609 Code: e1; Length: 13.5 mm; |
Datasheet | MT44K32M18RB-107E:BTR Datasheet |
In Stock | 1,801 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Standby Current: | .225 Amp |
Organization: | 32MX18 |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.2 mm |
Access Mode: | MULTI BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 1.28 V |
Surface Mount: | YES |
Maximum Supply Current: | 2565 mA |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 168 |
Maximum Clock Frequency (fCLK): | 934.5 MHz |
No. of Words: | 33554432 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B168 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 95 Cel |
Package Code: | TBGA |
Width: | 13.5 mm |
Input/Output Type: | COMMON |
No. of Ports: | 1 |
Memory Density: | 603979776 bit |
Self Refresh: | NO |
Sequential Burst Length: | 2,4,8 |
Memory IC Type: | RLDRAM3 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 18 |
No. of Functions: | 1 |
Package Equivalence Code: | BGA168,13X13,40 |
Interleaved Burst Length: | 2,4,8 |
Length: | 13.5 mm |
No. of Words Code: | 32M |
Nominal Supply Voltage / Vsup (V): | 1.35 |
Additional Features: | AUTO REFRESH |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1 mm |
Maximum Supply Voltage (Vsup): | 1.45 V |